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  • AIM 3D Electronics Box - Physics Setup

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  • Create a thermal physics region of material copper for the chips and CPU.
  • Add an inlet with velocity 57.609 in/s.
  • Add an outlet with pressure 0 Pa.
  • Add a solid heat generation term to the chips and CPU.
  • Add an insulated boundary to the bottom of the chips and CPU.
  • Add a wall.
  • Change convergence criteria to 1e-3.


Go to Step 5: Numerical Results

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