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In the Boundary Conditions window, select Outlet. Check to make sure that the Type is set to Pressure-Outlet and press Edit.... In the Momentum tab, the Gauge Pressure (pascal) should be set to 0. Next, click on the Thermal tab. Change the Backflow Total Temperature to 318.706 Kelvin and press OK.

Heat Generation

Now, we will set up the boundary conditions governing the heat generation inside the box. In the Boundary Conditions Outline window, select heatgeneration. Make sure the Type is set as Wall, and select Edit.... Select the Thermal tab. We can calculate the heat flux given the surface area of each chip.

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Enter the Heat Flux as 271.25 W/m^2. Also, change the Material Name to copper. Press OK

Image RemovedCell Zone Conditions. Under _Zones, select HeatGeneration and press Edit.
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Wall

Next, we need to specify the wall material as ABS plastic. In the Boundary Conditions menu, select wall-solid and press Edit.... Select the Thermal tab, and change the Material to ABS.

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