Any e-beam exposure is highly dependant upon processing and the substrate. This information is provided as a starting point and will required experimentation to optimize things for your work. Some of the information contained here is reprinted from resist data sheets from the manufacturer. Often, more information is available when you need to develop a specific resist process to use.
Many of the chemicals involved in resist processing can be extremely dangerous. Solvents such as acetone are highly flammable and explosive. Chlorinated solvents such as and methylene chloride are carcinogenic. Potassium hydroxide and TMAH developers are bases with a Ph of 14. Skin contact with these chemicals is immediately dangerous, and eye contact will quite possibly result in loss of sight. Mask processing involves use of highly dangerous strong acids.
BEFORE you can do any resist processing, you must be familiar with the chemicals you will be using, and know and respect the dangers of them. (source)
