Introduction

Direct laser lithography or direct laser writing using two-photon deep ultraviolet laser for additive 3d manufacturing using conventional resin sensitive to two-photon absorption resulting in two-photon polymerization to create volumetric prints from CAD models.

Exposure System

The NanoScribe GT2 Laser Lithography System is an ultramodern two-photon polymerization volumetric maskless printer. It is one of our newest acquisitions here at the Cornell NanoScale Facility (CNF). The tool was purchased in late 2019 and delivered and installed during the second week of January 2020. This was accomplished with the help of a committee of faculty and researchers, and a grant from the NSF. The NanoScribe GT2 can create three-dimensional nanostructures using a NIR femtosecond laser via direct-write onto a photosensitive resin, which is subjected to a non-linear two-photon absorption process. This process involves cross-linking the resin via UV absorption. The laser sets a focal light cone where a concentration of the light intensity defines the exposure focal spot volume or a “3D Pixel.” Using this technique, a CAD design can be broken into an X-Y-Z coordinate system to define the structure pixel by pixel and layer by layer. The exposure side of the system sits in a fine-tuned vibration isolation table and a high-speed ultra-precise piezoelectric stage for movement in X-Y-Z and uses a galvanic mirror defection system for focusing and beam rasterization. Models for printing can be designed using the stand-alone software DeScribe—which comes with the tool—or with any CAD software capable of outputting file formats DXF or STL. The DeScribe software can import these formats. 

3D Print Technology & Direct wright

Laser-based direct writing has been around for a few years especially in the semiconductor industry known as maskless lithography (MPL). Typically, the two-dimensional CAD design is transferred onto the substrate that is pre-coated with a photosensitive resin via reduction laser projection. The projected pattern was reduced given the tool's numerical aperture and scan across the surface of the substrate using either a raster or vector format. These techniques are the same ones utilized in 3D direct-write. The only difference is that now you are working with a thickness degree of freedom that can be scanned across the Z-axis. The NanoScribe GT2 has a Piezo Nanopositioning stage and a high-speed galvo scanner. In the case of two-photon lithography, the light source is a pulsed femtosecond fiber laser with the center wavelength being around 780 nm. 

Hardware Overview

Diagram of a simplified optical path of a Two-Photon Lithography System.

Utilized Objectives [NA: 10x, 25x, 63x]

Sample Holders at the CNF

Two-photon Light Source

Training

Cornell NanoScale's Training Workflow

NanoScribe's Subsystems

Power UP and Power DOWN Procedures [STAFF ONLY]

Power UP Procedure

Warning!

"Disregard of the guidelines concerning power-up of the Photonic Professional GT2 may cause damage to the system!"

Apply the following sequence in order to power up the Photonic Professional GT2 (See Fig)

  1. Turn the mains power switch to position 1.

  2. Wait some seconds until the reset and open buttons blink in alternation and the attention indicator is lit up.

  3. Press the reset button, the attention indicator switches off.

  4. Switch on the Photonic Professional GT2 Controller by activating the key switch.

  5. Switch on the Control PC: Let it boot completely before proceeding, wait until the long on-screen shows up.

  6. Switch on the laser controller by activating the key switch. The button start/stop does not have to be pushed (the backlight of the button should be off). The laser emission is controlled via the Photonic Professional GT2 control software NanoWrite.

  7. Switch on the GT power supply.

  8. Switch on the z-drive power supply.

  9. Switch on the computer monitor.

  10. Press the open button in order to release the safety lock and to open the printing cabinet. As long as the safety lock is released the open button is blinking white.

    Note: The laser gives acoustic feedback, as soon as its start-up is finished. This can take up to 30 s. After that, the control software NanoWrite may be launched. Make sure that the laser is operational when starting NanoWrite. The laser emission is switched on automatically when NanoWrite starts. The status of laser emission is indicated by the backlight of the button start/stop on the front panel of the laser controller. If the light is activated, the emission is on. You can manually switch on/off the emission by pressing this button. A power calibration of the laser is performed automatically before the first print starts or when NanoWrite receives the first script command.

Power Down Procedure

Warning!

"Disregard of the guidelines concerning power-up of the Photonic Professional GT2 may cause damage to the system!"

Apply the following sequence in order to shut down the Photonic Professional GT2 (See Fig)

  1. Exit NanoWrite. Wait until NanoWrite is shut down. Otherwise, error messages may occur. In general, the laser emission is switched off automatically when exiting NanoWrite.

  2. Shut down the computer.

  3. Make sure the objective lens is in the lowermost position. Check for the message lower z-limit reached on the touch panel.

  4. Switch off the z-drive power supply.

  5. Switch off the GT power supply.

  6. Check the status of the laser emission; if the backlight of the button start/stop is activated, press it to switch off the emission.

  7. Switch off the laser controller by deactivating the key switch.

  8. Switch off the Photonic Professional GT2 controller by deactivating the key switch.

  9. Switch off the Photonic Professional GT2 by turning the mains power switch to position 0.

Warning!

Never switch off the Photonic Professional GT2 Controller or the mains power switch prior to any of the other components. This might cause damage to the system. The emergency shutdown of the system should only be used under dangerous situations. Do not use it as a standard shut down procedure.

CAD & Software

CAD Model

Since NanoScribe only handles the fracturing and slicing of the imported CAD design utilizing its own proprietary General Writing Language (GWL) complex models need to be designed and verified outside of the system and when ready exported as a Standard Triangle Language or Standard Tessellation Language (STL). STLs describe the raw unstructured triangular surface geometry of three-dimensional using normalized units and vertices objects without any color or texture attributes. STLs can be written in both ASCII and binary.  

3D CAD Software Available at the CNF

Note: Sofware usage is limited and or restricted depending on the type of license the CNF currently is under contract.  

DeScribe

Recipes: DeScribe Tabulated Solution Set based Parameters:

Solution SetObjectiveResinSubstrateSample HolderSlicingHatchingDev/Rinse
SF63xIP-L / IP-DIPFused Silica / Borosilicate SubstratesDILL / DiLL Oil0.3 um0.2 um12 min
MF25xIP-SITO-CoatedDiLL1 um0.5 um20 min
LF10xIP-QSiliconDiLL5 um1 um20 min

Alignment & Overlay

GWL Programming

Python Scripting

NanoWrite

Sequence Of Operations


General PrintingOperational Workflow (SOP) as stated in the NanoGuide

The basic standard operation procedure (SOP) is summarized below. The titles link to pages with more detailed information.
The paragraph headers of this page link to important safety measures. Carefully read through each article to avoid harm to the operator and damage to hardware components. Additionally read through printing considerations, which provides general information for a successful print along with best practice advice.

Check the status of the printer

Import a CAD model file

Prepare a sample and change the objective

Start NanoWrite and insert sample holder

Perform a sample approach

Load a print job

Print your structure

Unload the sample

Develop the sample

Clean the objective lens

Leaving the printer

Multi-DiLL Printing

Multiple samples can be printed sequentially without the need to open the printer and switch substrates. This is useful for jobs where a large number of samples are needed, particularly if print times are short. The procedure for setting up a Multi-DiLL print will reference this build folder which is available for download: Sample01_02_03.zip The builds are based on these simple STLs: sampleSTLs.zip.

NewStructure
SamplePosition 4
Wait 20
MessageOut "Start printing the 1st sample"
include Sample1\sample1_job.gwl

NewStructure
SamplePosition 5
Wait 20
MessageOut "Start printing the 2nd sample"
include Sample2\sample2_job.gwl

NewStructure
SamplePosition 6
Wait 20
MessageOut "Start printing the 3rd sample"
include Sample3\sample3_job.gwl

Material Specifications for standard printing at CNF

Substrates Specifications:

@ 780 nmFused Silica SubstratesITO-Coated SubstratesSilicon SubstratesBorosilicate SubstratesMicroscope Slides
MaterialFused SilicaSoda Lime w/ ITOSi SubstratesBorosilicate SubMicroscope Slides
Sample HolderDiLLDiLLDiLL10 × Ø 30 mmDiLL
Refractive index1.4541.624 [ITO] 1.518 [soda lime]3.7101.5171.518
Dimension[25, 25, 0.7] mm[25, 25, 0.7] mm[25, 25, 0.725] mm30 mm Ø, 170 µm[22, 75, 1] mm
Thickness variation± 25 µm± 60 µm± 25 µm± 10 µm± 100 µm
Surface finishDSPDSPPolishedDSPDSP
Density2.2 g/cm32.5 g/cm32.3290 g/cm3

Mohs hardness5.3-6.55-69-10

Melting point1400°C1000°C3265°C

Thermal expansion coefficient0.54x10-6 K-10.937 W/m·K2.6 µm/(m·K)

Heat conductivity1.38 W/(m·K)0.937 W/(m·K)149 W/(m·K)

Compatible w/ Solution Set3D SF3D MF (3D SF, 2D ML)3D LF (3D MF, 3D SF, 2D ML)3D SF Oil3D SF
Compatible w/ 2PP resinIP-DIPIP-SIP-Q (IP-S, IP-Dip, AZ resin)IP-L 780 or IP-G 780None, unless coated
Compatible w/ Objective63X20x, 25x , 63x10x, (20x, 25x, 63x)63x63x
Combination & Ref index-0.058 @ 20°C IP-Dip / -0.025 @ 20°C IP-S-0.145 @ 20°


Contrast




Cleaning & PrepO2-plasma & silanizationO2-plasma & silanizationRC1

Indium-Tin Oxide (ITO) Coating Specifications:

ITOValue
Film Thickness18 nm ± 5 nm
Film Surface Resistance100 - 300 Ω
Film Transmittance≥89%

Sample Holders available at the CNF

Sample HolderSubstrate TypeSubstrate Thickness

DiLL


  1. Microscope Slide: 24-26 mm x 50-76 mm

  2. Fused Silica Substrate, ITO-Coated substrate, Silicon Substrate: 25 x 25 mm²

  3. Borosilicate Substrate: Ø 30 mm
  4. Tiny Substrates: 12 mm > Ø 30 mm > 25.4 mm



1.00 mm

0.70 mm, 0.70 mm, 0.725 mm

0.17 mm 
0.30 mm


Multi-DiLL

Fused Silica Substrate, ITO-Coated substrate, Silicon Substrate: 25 x 25 mm²

0.70 mm, 0.70 mm, 0.725 mm

2" Wafer

Ø 2 inch Wafer0.35 – 0.55 mm

10 × Ø 30 mm

Ø 30 mm0.17 mm

These resins are available at the CNF:

  • IP-DIP: IP-Dip is a liquid negative-tone 2PP resin formulation by NanoScribe designed for printing the finest possible features. IP-Dip is a component of the 3D SF Solution Set. Tall structures exceeding the working distance of the objective can be printed using the DiLL configuration.
  • IP-S: IP-S is a highly viscous liquid negative-tone 2PP resin formulation by NanoScribe designed for printing medium-sized features in DiLL. IP-S combines low shrinkage and high stability with a smooth structural surface finish perfect for micro-optics. The photosensitivity is tailored for two-photon polymerization and UV-curing is also possible. As a component of the 3D MF solution set, IP-S is suitable for printing structures with dimensions of several cubic millimeters.
  • IP-L 780: IP-L 780 is a liquid negative-tone 2PP resin formulation designed for printing small features in oil immersion configuration. IP-L 780 combines high resolution with low shrinkage and high stability.
  • IP-Q: IP-Q is a highly viscous liquid negative-tone 2PP resin formulation by NanoScribe. The 3D LF Microfabrication Solution Set, including IP-Q, extends 2PP 3D printing towards rapid printing of mesoscale structures with millimeter sizes, micrometer precision, and maximum throughput up to the macroscale.
  • SU-8: SU-8 is a UV-curable negative-tone 2PP resin by Kayaku Advanced Materials. This resin is well-known and widely used in the lithography community. [The following article applies only to SU-8 100 determined to be the most suitable resin for 2PP as it balances quality and printing speed.]


Developer 

Metrology & Post Processing

Aspect Ration & Selectivity

Model UV Curing

Silicon Wafer Substrate Production

Standard Type P silicon wafers can be cut to produce 25mm square substrates for use with the 10X and other processes using the CNF DISCO Dicing Saw. Users must provider their own wafer for slicing; for best results, wafers should be 700µm thick +/-25µm. After receiving training on this tool, a program has been saved that is available to dice 6" wafers for use in the Nanoscribe. When using the DISCO Dicing Saw, open the USER directory and select the Nanoscribe6in profile. Please note: this profile is currently set for a 675µm thick wafer; you MUST adjust this parameter for thicker or thinner wafers.

Once you have completed the alignment process (typically aligning only along the flat edge of the wafer is adequate), a total of at least 18 substrates will be produced. Take care to ensure that substrates are free of debris from cutting before using in the NanoScribe. Additional cleaning of substrates via sonication with consecutive baths acetone, IPA, and DI water is recommended.

ITO Borosilicate Substrate Deposition Process 

Model Removal & Resin Stripping

Applications

Publications & Gallery


Other Files

Users may wish to store their new and used 25mm square substrates. A set of STL files is provided for users to download and 3D print; each holder can fit 20 substrates.

It is recommended that these be printed with an SLA or similar process, as tolerances are tighter than allowable by FDM printing.


Other Sites in the NNCI Network with a NanoScribe




Note: A large part of the background information comes from NanoScribe's NanoGuide, Wikipedia, and ZEISS .