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- Options for running DeScribe Software
- The most current version v2.7 as of 610/305/22
- It is highly recommended that you use the most current version of DeScribe to have access to the latest recipes and print modes.
- In v 2.7, most recipes are included in DeScribe and do not need to be downloaded separately
- Users can download their copy here (requires software license and Nanoguide access)
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Sample Holder | Substrate Type | Substrate Thickness | Holder Image | CAD Files | ||||||||
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DiLL |
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Multi-DiLL | Fused Silica Substrate, ITO-Coated substrate, Silicon Substrate: 25 x 25 mm² | 0.70 mm, 0.70 mm, 0.725 mm | *Note: some dimensions are approximated | |||||||||
2" Wafer | Ø 2 inch Wafer | 0.35 – 0.55 mm | ||||||||||
10 × Ø 30 mm | Ø 30 mm | 0.17 mm |
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Resins are available at the CNF
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Advanced Printing Procedures
Parameter Sweeps
While the default DeScribe settings work in many cases, high precision parts may require careful tailoring of the printing parameters, such as laser scan speed, laser power, hatching distance, among others. The quickest way to test a variety of these parameters is with the Advanced STL Processing tool in DeScribe. Using a test STL, usually a small part or feature, one can generate a 1D or 2D array of parts with parameters varied between a start and end point. The image below illustrates a 4x4 array which varies scan speed and hatching distance, which impacts effective laser dose and can highlight issues due to proximity effect:
GWL Programming
Advanced printing procedures often require modification to the basic files generated by the DeScribe slicer. In addition to offering much greater control over your print, a user can stitch together multiple jobs into a single part with differing print modes, or even objectives. Many of the most useful commands are highlighted in the sections below. A full reference list is available on Nanoguide and in the DeScribe editor under Window → Command Reference.
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