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| - IP-DIP: IP-Dip is a liquid negative-tone 2PP resin formulation by NanoScribe designed for printing the finest possible features. IP-Dip is a component of the 3D SF Solution Set. Tall structures exceeding the working distance of the objective can be printed using the DiLL configuration.
- IP-S: IP-S is a highly viscous liquid negative-tone 2PP resin formulation by NanoScribe designed for printing medium-sized features in DiLL. IP-S combines low shrinkage and high stability with a smooth structural surface finish perfect for micro-optics. The photosensitivity is tailored for two-photon polymerization and UV-curing is also possible. As a component of the 3D MF solution set, IP-S is suitable for printing structures with dimensions of several cubic millimeters.
- IP-L 780: IP-L 780 is a liquid negative-tone 2PP resin formulation designed for printing small features in oil immersion configuration. IP-L 780 combines high resolution with low shrinkage and high stability.
- IP-Q: IP-Q is a highly viscous liquid negative-tone 2PP resin formulation by NanoScribe. The 3D LF Microfabrication Solution Set, including IP-Q, extends 2PP 3D printing towards rapid printing of mesoscale structures with millimeter sizes, micrometer precision, and maximum throughput up to the macroscale.
- SU-8: SU-8 is a UV-curable negative-tone 2PP resin by Kayaku Advanced Materials. This resin is well-known and widely used in the lithography community. [The following article applies only to SU-8 100 determined to be the most suitable resin for 2PP as it balances quality and printing speed.]
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GP-Silica Resin
A new resin will soon be available for use. GP-Silica contains silica particles which can be sintered into solid fused silica parts. Using the LF solution set, users can develop robust parts with mechanical and optical properties very similar to bulk fused silica.
Some substantial differences exist compared to IP-Q and similar acrylate resins:
- Maximum part printing time of 15 hours - exceeding this time may cause severe lens damage, as the resin will slowly cure and solidify over time.
- Parts must be developed in methanol and should develop horizontally to prevent premature part-substrate separation
- After development, parts must be sintered to come to full strength. Currently, CCMR's controlled atmosphere furnaces are recommended for thermal processing. Sintering curves are available on Nanoguide.
Developer
- PGMEA (CAS NO. 108-65-6) (For IP-Dip, IP-S, IP-Q, IP-L, SU-8)
- Methanol (CAS No. 67-56-1) (For GP-Silica only)
- Isopropanol (CAS No. 67-63-0) (For secondary wash, all resins)
Metrology & Post Processing
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