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- Autodesk
- AutoCAD
- Inventor
- Meshmixer
- DeScribe
- FreeCAD
- MeshLab
- LinkCAD
You may opt to use the CNF 3D GPU Conversion Computer which has a number of software tools above as well as DeScribe available. Compile time on DeScribe is typically faster on this system than a standard Windows desktop PC by 2-3 times for complex 3D object. Instructions for its use are available here.
DeScribe
- Options for running DeScribe Software
- The most current version v2.7 as of 6/30/22
- It is highly recommended that you use the most current version of DeScribe to have access to the latest recipes and print modes.
- In v 2.7, most recipes are included in DeScribe and do not need to be downloaded separately
- Users can download their copy here (requires software license and Nanoguide access)
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Thermal shocking of the substrate via hot plate is an effective method for some parts, typically temperatures of ~90°C are adequate, higher temperatures may risk damaging or overcuring parts.
In some cases, sonication may work to dislodge a part from its substrate, using short durations (<1 min) and checking your part often.
Silicon Wafer Substrate Production
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