Versions Compared

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.

...

  • Autodesk 
    • AutoCAD
    • Inventor 
    • Meshmixer
  • DeScribe
  • FreeCAD
  • MeshLab
  • LinkCAD

You may opt to use the CNF 3D GPU Conversion Computer which has a number of software tools above as well as DeScribe available. Compile time on DeScribe is typically faster on this system than a standard Windows desktop PC by 2-3 times for complex 3D object. Instructions for its use are available here.

DeScribe

  • Options for running DeScribe Software
  • The most current version v2.7 as of 6/30/22
    • It is highly recommended that you use the most current version of DeScribe to have access to the latest recipes and print modes.
    • In v 2.7, most recipes are included in DeScribe and do not need to be downloaded separately
    • Users can download their copy here (requires software license and Nanoguide access)

...

Thermal shocking of the substrate via hot plate is an effective method for some parts, typically temperatures of ~90°C are adequate, higher temperatures may risk damaging or overcuring parts.

In some cases, sonication may work to dislodge a part from its substrate, using short durations (<1 min) and checking your part often.

Silicon Wafer Substrate Production

...