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Aspect Ratio & Selectivity
Model UV Curing
- Parts, particularly shell and scaffold components, may require a UV cure after development.
- Shell and scaffold parts contain uncured resin within solid walls. Failure to UV cure will result in weak parts and may leak resin.
- The resin's highest sensitivity is to 405 nm UV, however broad spectrum UV curing stations may also work.
- NOTE: The resin may burn or become distorted with UV power densities above 7 W/m2
- Typical maximum cure depth is 2.5 mm
- Recommended exposure time is 2-15 minutes, dependent on part geometry
- A UV curing box in the development hood is under construction
- Alternately, parts may be heat cured. IP-S cures in 5 minutes at 190C and 17 h at 140C. Care must be taken to slowly heat samples; thermal shock may break your part off the substrate prematurely. IP-DIP and IP-L cannot be heat cured.Curing Box [Under Construction]
Silicon Wafer Substrate Production
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