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| Solution Set | Objective | Resin | Substrate | Sample Holder | Slicing | Hatching | Dev/Rinse |
|---|---|---|---|---|---|---|---|
| SF | 63x | IP-L / IP-DIP | Fused Silica / Borosilicate Substrates | DILL / DiLL Oil | 0.3 um | 0.2 um | 12 min |
| MF | 25x | IP-S | ITO-Coated | DiLL | 1 um | 0.5 um | 20 min |
| LF | 10x | IP-Q | Silicon | DiLL | 5 um | 1 um | 20 min |
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Printing Modes
The Nanoscribe uses solution sets which are paired to an objective in order to slice a CAD model. In general, each objective has a Solid, Shell and Scaffold, and Swift solution setprinting mode.
| Solution SetMode | Use Case |
|---|---|
| Solid | Slowest printing method, generates parts which do not require post-process UV curing generally. High resolution printing. Used for delicate or initricate parts where strength is a priority or long development times are required. |
| Shell and Scaffold | Faster than solid, speed dependent on part complexity and infill percentage. Parts have a high resolution shell with coarse infill to balance speed and high resolution. Will require UV cure. Used for intricate parts where development times are short (<1hr). |
| Swift | Fastest printing method, prints coarsely in a layerwise fashion in half the time of most shell and scaffold prints. Parts usually do not require UV cure. Balanced Swift is higher resolution than Swift, but longer print times. Used for bases or support structures where dimensional accuracy is not critical. |
Comparison of printing solutions by part resolution and print speed. Image from Nanoguide
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