...
- Close NanoWrite. This makes sure that used print commands are set to the default values for the next user.
- Only switch off the laser and other printer components if the printer is not in use for a longer period of time.
Multi-DiLL Printing
Multiple samples can be printed sequentially without the need to open the printer and switch substrates. This is useful for jobs where a large number of samples are needed, particularly if print times are short. The procedure for setting up a Multi-DiLL print will reference this build folder which is available for download: Sample01_02_03.zip The builds are based on these simple STLs: sampleSTLs.zip.
- Generate STL files as with any standard print job
- Import these files into DeScribe individually and generate a build using your selected solution set. It is important that all files use the same objective, however you may vary between solid and the shell and scaffold solutions.
- Keep the generated files in their own respective folders - organizing these files is very important to the process
- In this case, all files related to Sample1 are in a Sample1 folder
- Combine all sample folders to one master folder
- An example of the file structure is included below:
- Generate a *job.gwl file - this will tell NanoWrite the order of operations and which files to reference
- The example uses 1_2_3_job.gwl and is stored in the master folder. The gwl file can be created in a text editor (by changing .txt to .gwl or similar) and the content should be formatted as follows:
...
NewStructure
SamplePosition 4
Wait 20
MessageOut "Start printing the 1st sample"
include Sample1\sample1_job.gwl
NewStructure
SamplePosition 5
Wait 20
MessageOut "Start printing the 2nd sample"
include Sample2\sample2_job.gwl
NewStructure
SamplePosition 6
Wait 20
MessageOut "Start printing the 3rd sample"
include Sample3\sample3_job.gwl
- In this example, we are printing in positions 4, 5, and 6 on the Multi-DiLL holder.
- NewStructure: Tells NanoWrite to begin a new print
- SamplePosition: Tells NanoWrite which position in the sample holder to print
- Wait: Waits for an integer number of seconds to allow the resin to settle after the lens has approached
- MessageOut: Displays text to indicate a new job has started
- include: Opens the build files from the included path
- You may test your gwl file by opening it in DeScribe to verify the paths are correct. Generate a 3D preview (F5) and ensure there are no errors.
- Note: DeScribe will render all models on top of one another. This is normal behavior, as seen below:
- Copy the folder to the Nanoscribe computer
- Place your substrates in the positions indicated in your gwl file and add resin to them, using an appropriate amount for the sample printed
- Large deposits of resin may drip in the machine, please ensure a minimal amount is applied
- Insert the correct objective and the Multi-DiLL holder as with standard prints
- Select the position of your first print in NanoWrite. By default, the Multi-DiLL is set to position 5, as seen below. To reduce bubble formation in your print, it is best to change this to your first print position. Note that when clicking the new position on the Multi-DiLL graphic in the NanoWrite "Choose sample holder" dialog box, the view is from the bottom of the holder, so positions are flipped, e.g. position 1 is the top right. Click OK and then approach the sample.
- Load the *job.gwl file in your top folder in NanoWrite, in the case of the example load 1_2_3_job.gwl
- Start print job, the total print time scales linearly with the number of samples in the job
Material Specifications for standard printing at CNF
Substrates Specifications:
...
Indium-Tin Oxide (ITO) Coating Specifications:
...
Sample Holders available at the CNF
...
Material Specifications for standard printing at CNF
Substrates Specifications:
| @ 780 nm | Fused Silica Substrates | ITO-Coated Substrates | Silicon Substrates | Borosilicate Substrates | Microscope Slides |
|---|---|---|---|---|---|
| Material | Fused Silica | Soda Lime w/ ITO | Si Substrates | Borosilicate Sub | Microscope Slides |
| Sample Holder | DiLL | DiLL | DiLL | 10 × Ø 30 mm | DiLL |
| Refractive index | 1.454 | 1.624 [ITO] 1.518 [soda lime] | 3.710 | 1.517 | 1.518 |
| Dimension | [25, 25, 0.7] mm | [25, 25, 0.7] mm | [25, 25, 0.725] mm | 30 mm Ø, 170 µm | [22, 75, 1] mm |
| Thickness variation | ± 25 µm | ± 60 µm | ± 25 µm | ± 10 µm | ± 100 µm |
| Surface finish | DSP | DSP | Polished | DSP | DSP |
| Density | 2.2 g/cm3 | 2.5 g/cm3 | 2.3290 g/cm3 | ||
| Mohs hardness | 5.3-6.5 | 5-6 | 9-10 | ||
| Melting point | 1400°C | 1000°C | 3265°C | ||
| Thermal expansion coefficient | 0.54x10-6 K-1 | 0.937 W/m·K | 2.6 µm/(m·K) | ||
| Heat conductivity | 1.38 W/(m·K) | 0.937 W/(m·K) | 149 W/(m·K) | ||
| Compatible w/ Solution Set | 3D SF | 3D MF (3D SF, 2D ML) | 3D LF (3D MF, 3D SF, 2D ML) | 3D SF Oil | 3D SF |
| Compatible w/ 2PP resin | IP-DIP | IP-S | IP-Q (IP-S, IP-Dip, AZ resin) | IP-L 780 or IP-G 780 | None, unless coated |
| Compatible w/ Objective | 63X | 20x, 25x , 63x | 10x, (20x, 25x, 63x) | 63x | 63x |
| Combination & Ref index | -0.058 @ 20°C IP-Dip / -0.025 @ 20°C IP-S | -0.145 @ 20° | |||
| Contrast | |||||
| Cleaning & Prep | O2-plasma & silanization | O2-plasma & silanization | RC1 |
Indium-Tin Oxide (ITO) Coating Specifications:
| ITO | Value |
|---|---|
| Film Thickness | 18 nm ± 5 nm |
| Film Surface Resistance | 100 - 300 Ω |
| Film Transmittance | ≥89% |
Sample Holders available at the CNF
| Sample Holder | Substrate Type | Substrate Thickness | Holder Image | CAD Files | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
DiLL |
|
|
| |||||||||
| Fused Silica Substrate, ITO-Coated substrate, Silicon Substrate: 25 x 25 mm² | 0.70 mm, 0.70 mm, 0.725 mm |  | *Note: some dimensions are approximated | ||||||||
2" Wafer | Ø 2 inch Wafer | 0.35 – 0.55 mm |
| |||||||||
10 × Ø 30 mm | Ø 30 mm | 0.17 mm |
|
These resins are available at the CNF:
|
|
|---|
Developer
Metrology & Post Processing
Aspect Ration & Selectivity
Model UV Curing
- Curing Box [Under Construction]
Silicon Wafer Substrate Production
Standard Type P silicon wafers can be cut to produce 25mm square substrates for use with the 10X and other processes using the CNF DISCO Dicing Saw. Users must provider their own wafer for slicing; for best results, wafers should be 700µm thick +/-25µm. After receiving training on this tool, a program has been saved that is available to dice 6" wafers for use in the Nanoscribe. When using the DISCO Dicing Saw, open the USER directory and select the Nanoscribe6in profile. Please note: this profile is currently set for a 675µm thick wafer; you MUST adjust this parameter for thicker or thinner wafers.
Once you have completed the alignment process (typically aligning only along the flat edge of the wafer is adequate), a total of at least 18 substrates will be produced. Take care to ensure that substrates are free of debris from cutting before using in the NanoScribe. Additional cleaning of substrates via sonication with consecutive baths acetone, IPA, and DI water is recommended.
ITO Borosilicate Substrate Deposition Process
- Deposition chucks available [Under Construction]
Model Removal & Resin Stripping
Advanced Printing Procedures
Multi-DiLL Printing
Multiple samples can be printed sequentially without the need to open the printer and switch substrates. This is useful for jobs where a large number of samples are needed, particularly if print times are short. The procedure for setting up a Multi-DiLL print will reference this build folder which is available for download: Sample01_02_03.zip The builds are based on these simple STLs: sampleSTLs.zip.
- Generate STL files as with any standard print job
- Import these files into DeScribe individually and generate a build using your selected solution set. It is important that all files use the same objective, however you may vary between solid and the shell and scaffold solutions.
- Keep the generated files in their own respective folders - organizing these files is very important to the process
- In this case, all files related to Sample1 are in a Sample1 folder
- Combine all sample folders to one master folder
- An example of the file structure is included below:
- Generate a *job.gwl file - this will tell NanoWrite the order of operations and which files to reference
- The example uses 1_2_3_job.gwl and is stored in the master folder. The gwl file can be created in a text editor (by changing .txt to .gwl or similar) and the content should be formatted as follows:
NewStructure NewStructure NewStructure |
|---|
- In this example, we are printing in positions 4, 5, and 6 on the Multi-DiLL holder.
- NewStructure: Tells NanoWrite to begin a new print
- SamplePosition: Tells NanoWrite which position in the sample holder to print
- Wait: Waits for an integer number of seconds to allow the resin to settle after the lens has approached
- MessageOut: Displays text to indicate a new job has started
- include: Opens the build files from the included path
- You may test your gwl file by opening it in DeScribe to verify the paths are correct. Generate a 3D preview (F5) and ensure there are no errors.
- Note: DeScribe will render all models on top of one another. This is normal behavior, as seen below:
- Copy the folder to the Nanoscribe computer
- Place your substrates in the positions indicated in your gwl file and add resin to them, using an appropriate amount for the sample printed
- Large deposits of resin may drip in the machine, please ensure a minimal amount is applied
- Insert the correct objective and the Multi-DiLL holder as with standard prints
- Select the position of your first print in NanoWrite. By default, the Multi-DiLL is set to position 5, as seen below. To reduce bubble formation in your print, it is best to change this to your first print position. Note that when clicking the new position on the Multi-DiLL graphic in the NanoWrite "Choose sample holder" dialog box, the view is from the bottom of the holder, so positions are flipped, e.g. position 1 is the top right. Click OK and then approach the sample.
- Load the *job.gwl file in your top folder in NanoWrite, in the case of the example load 1_2_3_job.gwl
- Start print job, the total print time scales linearly with the number of samples in the job
...
DiLL
|
2. Fused Silica Substrate, ITO-Coated substrate, Silicon Substrate: 25 x 25 mm² |
| 3. Borosilicate Substrate: Ø 30 mm |
| 4. Tiny Substrates: 12 mm > Ø 30 mm > 25.4 mm |
| 1.00 mm |
0.70 mm, 0.70 mm, 0.725 mm |
| 0.17 mm |
| 0.30 mm |
...
...
Multi-DiLL
...
Fused Silica Substrate, ITO-Coated substrate, Silicon Substrate: 25 x 25 mm²
...
*Note: some dimensions are approximated
...
2" Wafer
...
...
10 × Ø 30 mm
...
These resins are available at the CNF:
...
...
- IP-DIP: IP-Dip is a liquid negative-tone 2PP resin formulation by NanoScribe designed for printing the finest possible features. IP-Dip is a component of the 3D SF Solution Set. Tall structures exceeding the working distance of the objective can be printed using the DiLL configuration.
- IP-S: IP-S is a highly viscous liquid negative-tone 2PP resin formulation by NanoScribe designed for printing medium-sized features in DiLL. IP-S combines low shrinkage and high stability with a smooth structural surface finish perfect for micro-optics. The photosensitivity is tailored for two-photon polymerization and UV-curing is also possible. As a component of the 3D MF solution set, IP-S is suitable for printing structures with dimensions of several cubic millimeters.
- IP-L 780: IP-L 780 is a liquid negative-tone 2PP resin formulation designed for printing small features in oil immersion configuration. IP-L 780 combines high resolution with low shrinkage and high stability.
- IP-Q: IP-Q is a highly viscous liquid negative-tone 2PP resin formulation by NanoScribe. The 3D LF Microfabrication Solution Set, including IP-Q, extends 2PP 3D printing towards rapid printing of mesoscale structures with millimeter sizes, micrometer precision, and maximum throughput up to the macroscale.
- SU-8: SU-8 is a UV-curable negative-tone 2PP resin by Kayaku Advanced Materials. This resin is well-known and widely used in the lithography community. [The following article applies only to SU-8 100 determined to be the most suitable resin for 2PP as it balances quality and printing speed.]
Developer
Metrology & Post Processing
Aspect Ration & Selectivity
Model UV Curing
- Curing Box [Under Construction]
Silicon Wafer Substrate Production
Standard Type P silicon wafers can be cut to produce 25mm square substrates for use with the 10X and other processes using the CNF DISCO Dicing Saw. Users must provider their own wafer for slicing; for best results, wafers should be 700µm thick +/-25µm. After receiving training on this tool, a program has been saved that is available to dice 6" wafers for use in the Nanoscribe. When using the DISCO Dicing Saw, open the USER directory and select the Nanoscribe6in profile. Please note: this profile is currently set for a 675µm thick wafer; you MUST adjust this parameter for thicker or thinner wafers.
Once you have completed the alignment process (typically aligning only along the flat edge of the wafer is adequate), a total of at least 18 substrates will be produced. Take care to ensure that substrates are free of debris from cutting before using in the NanoScribe. Additional cleaning of substrates via sonication with consecutive baths acetone, IPA, and DI water is recommended.
ITO Borosilicate Substrate Deposition Process
- Deposition chucks available [Under Construction]
Model Removal & Resin Stripping
...
Manual Interface Finding
WARNING: MANUAL INTERFACE FINDING MAY RESULT IN A COLLISION BETWEEN THE SUBSTRATE AND LENS IF DONE IMPROPERLY. IF YOU HAVE CONCERNS, PLEASE CONTACT A STAFF MEMBER BEFORE ATTEMPTING.
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