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- Curing Box [Under Construction]
Silicon Wafer Substrate Production
Standard Type P silicon wafers can be cut to produce 25mm square substrates for use with the 10X and other processes using the CNF DISCO Dicing Saw. Users must provider their own wafer for slicing. After receiving training on this tool, a program has been saved that is available to dice 6" wafers for use in the Nanoscribe. When using the DISCO Dicing Saw, open the USER directory and select the Nanoscribe6in profile. Please note: this profile is currently set for a 675um thick wafer; you MUST adjust this parameter for thicker or thinner wafers.
Once you have completed the alignment process (typically aligning only along the flat edge of the wafer is adequate), a total of at least 18 substrates will be produced. Take care to ensure that substrates are free of debris from cutting before using in the NanoScribe. Additional cleaning of substrates via sonication with consecutive baths acetone, IPA, and DI water is recommended.
ITO Borosilicate Substrate Deposition Process
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