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Cornell Cup USA presented by Intel
M-Eng Project Credit and Course Credit Positions Available
The Cornell Cup USA presented by Intel competition creation team last year proved that they could create some of the most exciting robotics designs in the world. And they did it at the same time while empowering college teams from other top schools such as Berkley, MIT, UPenn, Purdue, Columbia and many more to create their own embedded systems. With more colleges hoping to take part, more companies looking to join as sponsors this year (and even Bill Nye the Science Guy looking to get involved) this year the team aims to expand and refine the existing ModBot (Modular Robotics Platform) and here are just some of the areas being targeted for development:

  • Robotic Dune Buggy
  • Robotic Laser Tag
  • Outdoor Localization
  • Vision Systems (Onboard and External)
  • 5 degree of freedom Robotic Arms
  • PC and Embedded System Communications
  • Incorporating a new Intel Atom microprocessor board with a built-in Altera FPGA
  • Autonomous and Semi-Autonomous Control Schemes
  • Model Predictive Control
  • Obstacle Avoidance and Path Planning
  • Turret and Launcher Systems
  • Connection to mobile devices
  • Adaptive GUI design
  • Simulation
  • VideoGame-like A.I.
  • Power Systems


Many companies are now specifically targeting students who have had experience in college robotics projects as these students have been recognized as having the skills necessary to apply their knowledge and gain new knowledge more quickly in multi-disciplinary teams. This is your opportunity to become one of the members of a robotics effort that is quickly gaining national and even international attention from industry, government, academic, and media groups while earning you invaluable experience in particularly Electrical, Mechanical, & Systems Engineering and Computer Science. More so, this project will also enable you to make a significant difference in engineering education systems where you will inspire future students to make a difference through engineering as we once again showcase our work at Walt Disney World in May. Sponsored by Intel, NASA, Tektronix, Mathworks, and GE.
Information Sessions will be held at the following times and locations:
Monday, 8/27 @ 6:30 PM in Upson B17
Thursday, 8/30 @ 6:00 PM in Kimball B11
Tuesday, 9/4 @ 6:00 PM in Upson B17
Wednesday, 9/5 @ 6:00 PM

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in Upson B17
Contact: Dr. David R. Schneider, drs44@cornell.edu, (607)-254-540, www.systemseng.cornell.edu/intel